Cactus Materials, Inc. Developed Patent Pending Next Generation Advanced Packaging for High Power Electronics (WBG-Wide Band Gap Semiconductor) and Automotive Market.
(Especially Designed for High Temperature and Extreme Environment)
Cactus Materials, Inc. partnered with one of the best companies in the world located in Japan for High Volume Manufacturing.
Types of Packaging
Multipurpose Ceramic Package
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Opto Package |
MEMS Package |
Low Temperature Co-fired Ceramic Package
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Substrate for Wafer Tester |
Applications
IGBT
Solar Cell (HCPV) |
Semiconductor
Automotive High power electronics Medical Electronics 
Automotive - Regulator |
LED
Solar Cell (HCPV) |
Multipurpose Ceramic Packaging & Automotive Packaging
LGA, BGA, PGA Packages
Features
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• Excellent electrical performance in a wide range of package sizes
• Small through hole mounting package with rugged construction • High I/O signal carrying capacity |
• Hermetically encapsulated packages offering enhanced thermal dissipation
• EIAJ or JEDEC configurations |
Applications
Surface Mount CPGA packages are designed in ceramic multilayer package on cavity up and cavity down configurations. Traditional pin count package designs are supported in small and high pin configurations.
Opto Packaging
Features
Standard packages come ready with optical feed thru with choice of ball lens, glass or sapphire windows.
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Optical feed-thru packages feature ceramic-to-metal feed-thru leads for optimal function and reliability. The metallic body with standard or custom heat sink material. Laser feed-through with ball lens, glass or sapphire window.
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Applications
Butterfly, Mini-DIL and mini-pin packages all come with optical feed thru options.
MEMS Packaging
Features
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Our ceramic technology addresses the need for thermal conductivity, heat durability, mechanical strength and electrical strength with matching coefficients of thermal expansion.
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Applications
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