Types of Packaging

Multipurpose Ceramic Package

Opto Package

MEMS Package

Low Temperature Co-fired Ceramic Package
LED Package

Substrate for Wafer Tester

Technology

The brilliance is in the design.

State-of-the-art eDPC process reduces stress at copper plating, providing higher reliabilty than standard DBC and DPC processes.

IGBT

Solar Cell (HCPV)

Applications

Semiconductor
Automotive
High power electronics
Medical
​Electronics

Automotive - Regulator

LED

Solar Cell (HCPV)

Multipurpose Ceramic Packaging
LGA, BGA, PGA Packages

Features

• Excellent electrical performance in a wide range of package sizes 
• Small through hole mounting package with rugged construction 
• High I/O signal carrying capacity

• Hermetically encapsulated packages offering enhanced thermal dissipation
• EIAJ or JEDEC configurations

Applications

Surface Mount CPGA packages are designed in ceramic multilayer package on cavity up and cavity down configurations. Traditional pin count package designs are supported in small and high pin configurations.

Opto Packaging

Features

Standard packages come ready with optical feed thru with choice of ball lens, glass or sapphire windows.

• Excellent electrical performance in a wide range of package sizes
• Hermetically encapsulated packages offer enhanced thermal dissipation
• Small through hole mounting package with rugged construction

• Ceramic-to-metal feed-thru with precise ceramic dimensions and brazing
• High temperature copper/tungsten heat sink comes as a standard
• ​Selfloc lens attached to the body of the package
• Stainless washer on pipe end for better laser weld capability

Optical feed-thru packages feature ceramic-to-metal feed-thru leads for optimal function and reliability. The metallic body with standard or custom heat sink material. Laser feed-through with ball lens, glass or sapphire window.

Applications

Butterfly, Mini-DIL and mini-pin packages all come with optical feed thru options.

MEMS Packaging

Features

• Multilayer ceramic package
• Excellent electrical performance & thermal management
• Gold-plated leads

• For surface mount or socket applications
• Footprint compatible with J Leaded and PLCC

Our ceramic technology addresses the need for thermal conductivity, heat durability, mechanical strength and electrical strength with matching coefficients of thermal expansion.

Applications

• Automotive
• Consumer
• Semiconductor components

• Internet of Things (IoT)
• Security