Cactus Materials
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    • Semiconductors and 3D integration
    • Cactus IC Packaging
    • Antimicrobial Nanomaterials and 2D materials
    • Ceramic Materials & Components
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    • Room Temperature Wafer Bonding
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Cactus Materials, Inc

LIMITLESS POSSIBILITIES
3D Integration and Room Temperature Wafer Bonding
GaAs/Si, Si/Si, LiNbO3/Si, InP/Si... others..  
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Researched more than 2 years to develop state-of-the-art Wafer Bonding Technology 
Originally developed for NASA and other national labs 

Applications

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Semiconductor and Silicon Photonics

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WBG Packaging and High Power Electronics

Semiconductors and Silicon Photonics
Wafer Bonding | LTCC/RF/Ceramic Packaging | Flex Electronics

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Process Capability: up-to 8 inch wafers (see below process capability)

Room Temperature Wafer Bonding

  • Cactus developed proprietary low temperature wafer bonding techniques application for various materials: Oxide Bonding (CZ and FZ Wafers), LiTaO3-Si,  III-V to Si Wafer bonding, Multi-stack wafer alignment and bonding, and others.  
  • Low volume product development in-house. ​
  • Off-the-self products: Thick Silicon on Insulator (SOI) MEMS Wafers, Si-Si bonded wafers, Si-III/V Materials bonded wafers: ​Contact Cactus Engineers

Say hello!

sales@cactusmaterials.com
@ Cactus Materials, Inc.
  • Home
  • Products
    • Semiconductors and 3D integration
    • Cactus IC Packaging
    • Antimicrobial Nanomaterials and 2D materials
    • Ceramic Materials & Components
  • Services
    • Room Temperature Wafer Bonding
  • Research and Development
  • Leadership Team
  • Contact