Researched more than 2 years to develop state-of-the-art Wafer Bonding Technology 
Originally developed for NASA and other national labs 

Applications

Semiconductor and Silicon Photonics

WBG Packaging and High Power Electronics

Semiconductors and Silicon Photonics
Wafer Bonding | LTCC/RF/Ceramic Packaging | Flex Electronics

Process Capability: up-to 8 inch wafers (see below process capability)

Room Temperature Wafer Bonding

• Cactus developed proprietary low temperature wafer bonding techniques application for various materials: Oxide Bonding (CZ and FZ Wafers), LiTaO3-Si,  III-V to Si Wafer bonding, Multi-stack wafer alignment and bonding, and others.  
• Low volume product development in-house. ​
• Off-the-self products: Thick Silicon on Insulator (SOI) MEMS Wafers, Si-Si bonded wafers, Si-III/V Materials bonded wafers: ​Contact Cactus Engineers