Semiconductors and Silicon Photonics
Wafer Bonding | LTCC/RF/Ceramic Packaging | Flex Electronics
Process Capability: up-to 8 inch wafers (see below process capability)
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Room Temperature Wafer Bonding
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Price list (contact engineer for your specific application)

wafer_bonding_service_price_list.pdf | |
File Size: | 191 kb |
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thin_film_deposition_service_price_list.pdf | |
File Size: | 288 kb |
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