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3D Integration
&
​Room Temperature Wafer Bonding

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Researched more than 2 years to develop state-of-the-art Wafer Bonding Technology 
Originally developed for NASA and other national labs 

Applications

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Semiconductor and Silicon Photonics

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WBG Packaging and High Power Electronics

Semiconductors and Silicon Photonics
Wafer Bonding | LTCC/RF/Ceramic Packaging | Flex Electronics

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Process Capability: up-to 8 inch wafers (see below process capability)

Room Temperature Wafer Bonding

  • Cactus developed proprietary low temperature wafer bonding techniques application for various materials: Oxide Bonding (CZ and FZ Wafers), LiTaO3-Si,  III-V to Si Wafer bonding, Multi-stack wafer alignment and bonding, and others.  
  • Low volume product development in-house. ​
  • Off-the-self products: Thick Silicon on Insulator (SOI) MEMS Wafers, Si-Si bonded wafers, Si-III/V Materials bonded wafers: ​Contact Cactus Engineers

Price list (contact engineer for your specific application)

wafer_bonding_service_price_list.pdf
File Size: 191 kb
File Type: pdf
Download File

thin_film_deposition_service_price_list.pdf
File Size: 288 kb
File Type: pdf
Download File

Contact Us!

sales@cactusmaterials.com
@ Cactus Materials, Inc.
  • Home
  • Cactus Photonics
    • Products >
      • Silicon Detectors
    • Services >
      • Wafer Bonding and 3D integration
      • Integrated Circuit Packaging
      • Cryogenic Electronics Measurement
  • Cactus Nanotechnology
    • Antimicrobial Nanotechnology for Clean Water
  • News
  • Team
  • Contact