Cactus Materials, Inc. allocated 20% of the fab capacity to foundry services for mixed and high volume manufacturing
Key Capabilities
State-of-the-art Compound Semiconductor Epitaxial fab (up-to 200 mm) 3D AI Optical Chip Integration and Packaging fab through wafer bonding (up-to-200 mm) Silicon Carbide (SiC) High Voltage and High Temperature Devices (up-to-150 mm)
Key Equipment
State-of-the-art 40,000 sq. ft Class 100 clean room 100+ pieces of advanced equipment and tools